Display device including a liquid crystal layer including streaky polymers and liquid crystal molecules

ABSTRACT

According to one embodiment, a display device includes a first substrate, a second substrate, a liquid crystal layer including polymers and liquid crystal molecules, and a light-emitting element. The first substrate includes a transparent substrate, a scanning line, a signal line crossing the scanning line, a switching element electrically connected to the scanning line and the signal line, an organic insulating film overlapping the switching element, and a pixel electrode electrically connected to the switching element. A thickness of the organic insulating film located between the transparent substrate and the pixel electrode is less than a thickness of the organic insulating film overlapping the switching element.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2018-219297, filed Nov. 22, 2018, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device.

BACKGROUND

Recently, display devices using polymer dispersed liquid crystal capableof switching between a scattering state of scattering incident light anda transmitting state of transmitting incident light have been proposed.For example, a display device in which a reflective layer formed ofaluminum, silver or the like covers a pixel switch circuit has beendisclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing an example of a display device DSP of thepresent embodiment.

FIG. 2 is a plan view showing the first configuration example of a pixelPX in a first substrate SUB1.

FIG. 3 is an enlarged plan view showing an example of a switchingelement SW shown in FIG. 2 .

FIG. 4 is a cross-sectional view of a display panel PNL taken along lineA-B including the switching element SW shown in FIG. 3 .

FIG. 5 is a cross-sectional view of the display panel PNL taken alongline C-D including a scanning line G and a connection portion DEA shownin FIG. 3 .

FIG. 6 is a cross-sectional view of the display panel PNL taken alongline E-F including a signal line S shown in FIG. 3 .

FIG. 7 is a schematic view of the display panel PNL of the presentembodiment.

FIG. 8 is a plan view showing the second configuration example of thepixel PX in the first substrate SUB1.

FIG. 9 is a plan view showing the third configuration example of thepixel PX in the first substrate SUB1.

FIG. 10 is a plan view showing the fourth configuration example of thepixel PX in the first substrate SUB1.

FIG. 11 is a plan view showing the fifth configuration example of thepixel PX in the first substrate SUB1.

FIG. 12 is a plan view showing the sixth configuration example of thepixel PX in the first substrate SUB1.

FIG. 13 is a plan view showing the seventh configuration example of thepixel PX in the first substrate SUB1.

FIG. 14 is a plan view showing the eighth configuration example of thepixel PX in the first substrate SUB1.

FIG. 15 is an illustration for explaining a measurement method formeasuring the absorptance of a sample.

FIG. 16 is an illustration showing results of absorptance measurement ofmaterials used for forming the display panel PNL.

FIG. 17 is an illustration for explaining how light emitted from alight-emitting element LS propagates through the display device DSP.

FIG. 18 is an illustration showing results of luminance measurement inthe display device DSP of the present embodiment and display devices ofcomparative examples.

DETAILED DESCRIPTION

In general, according to one embodiment, a display device includes afirst substrate, a second substrate, a liquid crystal layer locatedbetween the first substrate and the second substrate and includingpolymers and liquid crystal molecules, and a light-emitting element. Thefirst substrate includes a transparent substrate, a scanning line, asignal line crossing the scanning line, a switching element electricallyconnected to the scanning line and the signal line, an organicinsulating film overlapping the switching element, and a pixel electrodeelectrically connected to the switching element, and a thickness of theorganic insulating film located between the transparent substrate andthe pixel electrode is less than a thickness of the organic insulatingfilm overlapping the switching element.

According to another embodiment, a display device includes a firstsubstrate, a second substrate, a liquid crystal layer located betweenthe first substrate and the second substrate and including polymers andliquid crystal molecules, and a light-emitting element. The firstsubstrate includes a transparent substrate, a scanning line, a signalline crossing the scanning line, a switching element electricallyconnected to the scanning line and the signal line, an organicinsulating film overlapping the switching element, and a pixel electrodeelectrically connected to the switching element, and the organicinsulating film is not between the transparent substrate and the pixelelectrode.

Embodiments will be described hereinafter with reference to theaccompanying drawings. The disclosure is merely an example, and properchanges in keeping with the spirit of the invention, which are easilyconceivable by a person of ordinary skill in the art, come within thescope of the invention as a matter of course. In addition, in somecases, in order to make the description clearer, the widths,thicknesses, shapes, and the like of the respective parts areillustrated schematically in the drawings, rather than as an accuraterepresentation of what is implemented, but such schematic illustrationis merely exemplary, and in no way restricts the interpretation of theinvention. Furthermore, in the specification and drawings, structuralelements which function in the same manner as or a similar manner tothose described in connection with preceding drawings are denoted by thesame reference numbers, and overlapping detailed descriptions thereofmay be appropriately omitted.

First Configuration Example

FIG. 1 is a plan view showing an example of a display device DSP of thepresent embodiment. A first direction X, a second direction Y and athird direction Z are, for example, orthogonal to each other but maycross one another at an angle other than 90°. The first direction X andthe second direction Y correspond to directions parallel to the surfacesof substrates constituting the display device DSP, and the thirddirection Z corresponds to the thickness direction of the display deviceDSP. In the present specification, a direction from a first substrateSUB1 toward a second substrate SUB2 will be referred to as the upperside (or simply above) and a direction from the second substrate SUB2toward the first substrate SUB1 will be referred to as the lower side(or simply below). In cases of “the second member above the firstmember” and “the second member below the first member”, the secondmember may be in contact with the first member or may be spaced apartfrom the first member. In addition, an observation position in which thedisplay device DSP is observed is assumed to be located on the pointingend side of an arrow indicating the third direction Z, and a view fromthis observation position toward an X-Y plane defined by the firstdirection X and the second direction Y will be referred to as a planarview.

In the present embodiment, a liquid crystal display device employingpolymer dispersed liquid crystal will be described as an example of thedisplay device DSP. The display device DSP includes a display panel PNL,a wiring substrate 1, an IC chip 2 and light-emitting elements LD.

The display panel PNL includes a first substrate SUB1, a secondsubstrate SUB2, a liquid crystal layer LC and a sealant SL. Each of thefirst substrate SUB1 and the second substrate SUB2 is in the form of aflat plate parallel to the X-Y plane. The first substrate SUB1 and thesecond substrate SUB2 overlap each other in a planar view. The firstsubstrate SUB1 and the second substrate SUB2 are bonded together by thesealant SL. The liquid crystal layer LC is held between the firstsubstrate SUB1 and the second substrate SUB2 and is sealed in with thesealant SL. In FIG. 1 , the liquid crystal layer LC and the sealant SLare indicated by different diagonal lines.

As shown in an enlarged schematic view in FIG. 1 , the liquid crystallayer LC includes polymer dispersed liquid crystal including polymers 31and liquid crystal molecules 32. For example, the polymers 31 are liquidcrystal polymers. The polymers 31 are in the form of streaks extendingin one direction. For example, an extension direction D1 of the polymers31 is a direction parallel to the first direction X. The liquid crystalmolecules 32 are dispersed in the gaps between the polymers 31, and arealigned such that major axes thereof align in the first direction X.Each of the polymer 31 and the liquid crystal molecule 32 has opticalanisotropy or refractive anisotropy. The responsiveness of the polymer31 to an electric field is lower than the responsiveness of the liquidcrystal molecule 32 to an electric field.

For example, the alignment direction of the polymer 31 hardly changesregardless of the presence or absence of an electric field. On the otherhand, the alignment direction of the liquid crystal molecule 32 changesin accordance with an electric field in a state where voltage higherthan a threshold value is applied to the liquid crystal layer LC. In astate where voltage is not applied to the liquid crystal layer LC, theoptical axis of the polymer 31 and the optical axis of the liquidcrystal molecule 32 are parallel to each other, and light which hasentered the liquid crystal layer LC is transmitted through the liquidcrystal layer LC and hardly scattered in the liquid crystal layer LC(transparent state). In a state where voltage is applied to the liquidcrystal layer LC, the optical axis of the polymer 31 and the opticalaxis of the liquid crystal molecule 32 cross each other, and light whichhas entered the liquid crystal layer LC is scattered in the liquidcrystal layer LC (scattering state).

The display panel PNL includes a display portion DA in which an image isdisplayed and a frame-shaped non-display portion NDA which surrounds thedisplay portion DA. The sealant SL is located in the non-display portionNDA. The display portion DA includes pixels PX arrayed in a matrix inthe first direction X and the second direction Y.

As shown in an enlarged view in FIG. 1 , each pixel PX includes aswitching element SW, a pixel electrode PE, a common electrode CE, aliquid crystal layer LC and the like. The switching element SW is formedof, for example, a thin-film transistor (TFT) and is electricallyconnected to a scanning line G and a signal line S. The scanning line Gis electrically connected to the switching elements SW providedrespectively in the pixels PX arranged in the first direction X. Thesignal line S is electrically connected to the switching elements SWprovided respectively in the pixels PX arranged in the second directionY. The pixel electrode PE is electrically connected to the switchingelement SW. Each pixel electrode PE faces the common electrode CE in thethird direction Z, and drives the liquid crystal layer LC (morespecifically, the liquid crystal molecules 32) by an electric fieldproduced between the pixel electrode PE and the common electrode CE.Capacitance CS is formed between, for example, an electrode having thesame potential as that of the common electrode CE and an electrodehaving the same potential as that of the pixel electrode PE.

The wiring substrate 1 is electrically connected to an extension portionEx of the first substrate SUB1. The wiring substrate 1 is a bendableflexible printed circuit. The IC chip 2 is electrically connected to thewiring substrate 1. For example, a display driver which outputs a signalnecessary for image display or the like is incorporated in the IC chip2. Note that the IC chip 2 may be electrically connected to theextension portion Ex. Each of the wiring substrate 1 and the IC chip 2may read a signal from the display panel PNL but mainly functions as asignal source which supplies a signal to the display panel PNL.

The light-emitting elements LD overlap the extension portion Ex. Thelight-emitting elements LD are arranged and spaced apart from oneanother in the first direction X. These light-emitting elements LD arearranged along an end portion E21 of the second substrate SUB2 and emitlight toward the end portion E21.

FIG. 2 is a plan view showing the first configuration example of thepixel PX in the first substrate SUB1. The first substrate SUB1 includesscanning lines G, signal lines G, a switching element SW, an organicinsulating film O, metal lines M, a capacitance electrode C and a pixelelectrode PE.

Two scanning lines G extend in the first direction X, and are arrangedand spaced apart from each other in the second direction Y. Two signallines S extend in the second direction Y, and are arranged and spacedapart from each other in the first direction X. The pixel PX correspondsto a region delimited by two signal lines S and two scanning lines G.

The switching element SW is arranged in an intersection portion in whichthe scanning line G and the signal line S intersect. Although thespecific configuration of the switching element SW will be describedlater, the switching element SW may be a bottom-gate type switchingelement in which a gate electrode is located below a semiconductor layeror may be a top-gate type switching element in which a gate electrode islocated above a semiconductor layer. The semiconductor layer is formedof, for example, amorphous silicon but may be formed of polycrystallinesilicon or an oxide semiconductor.

The organic insulating film O is patterned, and in the firstconfiguration example shown in FIG. 2 , the organic insulating film O isin the form of a grid in a planar view. That is, the organic insulatingfilm O overlaps the scanning lines G, the signal lines S and theswitching element SW. The organic insulating film O includes firstportions OX overlapping the scanning lines G and second portions OYoverlapping the signal lines S. The first portion OX has a first sidesurface E1 located close to the light-emitting elements LD, and a secondside surface E2 located on the opposite side from the first side surfaceE1. The first side surface E1 and the second side surface E2 extend inthe extension direction D1 of the polymers 31. The second portion OY hasa third side surface E3 and a fourth side surface E4 located on theopposite side from the third side surface E3.

In the present specification, a region in which the organic insulatingfilm O is arranged will be referred to as a first region A1 of the firstsubstrate SUB1, and a region in which the organic insulating film O isnot arranged will be referred to as a second region A2 of the firstsubstrate SUB1. The second region A2 is surrounded with the first regionA1 and is located on the inside of the first region A1.

The metal lines M are arranged in the first region A1, and in the firstconfiguration example shown in FIG. 2 , the metal lines M are in theform of a grid in a planar view. That is, the metal lines M overlap thescanning lines G, the signal lines S and the switching element SW. Themetal lines M include first line portions MX overlapping the scanninglines G and the first portions OX, and second line portions MYoverlapping the signal lines S and the second portions OY.

As indicated by a dot-dash line, the capacitance electrode C is arrangedover the pixels PX and is arranged over almost the entire region of thefirst substrate SUB1. That is, the capacitance electrode C is arrangedin both the first region A1 and the second region A2. The capacitanceelectrode C overlaps the switching element SW, the scanning lines G, thesignal lines S and the organic insulating film O in the first region A1.

The pixel electrode PE overlaps the capacitance electrode C in thesecond region A2. In the example shown in FIG. 2 , the pixel electrodePE is disposed on the inside of a region in which the organic insulatingfilm O is arranged. Note that the pixel electrode PE may be disposed insuch a manner as to overlap the first portions OX and the secondportions OY.

In the example shown in FIG. 2 , a spacer SP overlaps the switchingelement SW and forms a predetermined cell gap between the firstsubstrate SUB1 and the second substrate SUB2.

FIG. 3 is an enlarged plan view showing an example of the switchingelement SW shown in FIG. 2 . The switching element SW includes asemiconductor layer SC, a gate electrode GE, source electrodes SE and adrain electrode DE. The gate electrode GE is integrally formed with thescanning line G. The semiconductor layer SC overlaps the gate electrodeGE. Two source electrodes SE are integrally formed with the signal lineS and are in contact with the semiconductor layer SC. The drainelectrode DE is located between two source electrodes SE and is incontact with the semiconductor layer SC. The drain electrode DE includesa connection portion DEA. The connection portion DEA is electricallyconnected to the pixel electrode PE via an opening CA formed in thecapacitance electrode C, and a contact hole CH.

FIG. 4 is a cross-sectional view of the display panel PNL taken alongline A-B including the switching element SW shown in FIG. 3 . The firstsubstrate SUB1 further includes a transparent substrate 10, insulatingfilms 11 to 13 and an alignment film AL1. The transparent substrate 10includes a surface (lower surface) 10A and a surface (upper surface) 10Blocated on the opposite side from the surface 10A. The surfaces 10A and10B are surfaces substantially parallel to the X-Y plane. The gateelectrode GE, which is integrally formed with the scanning line G, isarranged on the surface 10B side. The insulating film 11 covers the gateelectrode GE and the scanning line G and is in contact with the surface10B. The semiconductor layer SC is located on the insulating film 11directly above the gate electrode GE. Two source electrodes SE, whichare integrally formed with the signal line S, are in contact with thesemiconductor layer SC and are partially located on the insulating film11. The drain electrode DE is in contact with the semiconductor layerSC. The insulating film 12 covers the semiconductor layer SC, the sourceelectrodes SE and the drain electrode DE which constitute the switchingelement SW, and also covers the insulating film 11.

The first portion OX of the organic insulating film O is in contact withan upper surface 12B of the insulating film 12 directly above the gateelectrode GE and the scanning line G or directly above the switchingelement SW. The first line portion MX of the metal line M is located onthe first portion OX directly above the gate electrode GE and thescanning line G or directly above the switching element SW.

The capacitance electrode C covers the first line portion MX and thefirst portion OX in the first region A1. That is, the first side surfaceE1 and the second side surface E2 of the first portion OX are coveredwith the capacitance electrode C. The first line portion MX is incontact with the capacitance electrode C and is electrically connectedto the capacitance electrode C. In addition, the capacitance electrode Cis in contact with the upper surface 12B of the insulating film 12 inthe second region A2.

The insulating film 13 is arranged in the first region A1 and the secondregion A2 and covers the capacitance electrode C. Each pixel electrodePE is located on the insulating film 13 in the second region A2. Thepixel electrode PE and the capacitance electrode C face each other viathe insulating film 13 and form storage capacitance necessary for imagedisplay in the pixel PX. The switching element SW is located between thepixel electrodes PE which are adjacent to each other in the seconddirection Y. Each of the first side surface E1 and the second sidesurface E2 is located between the switching element SW and the pixelelectrode PE in the second direction Y. The alignment film AL1 coversthe pixel electrode PE and the insulating film 13.

In the above-described first substrate SUB1, the thickness in the thirddirection Z of the organic insulating film O between the transparentsubstrate 10 and the pixel electrode PE is less than a thickness T0 inthe third direction Z of the organic insulating film O overlapping theswitching element SW. In the first configuration example shown in FIG. 4, the organic insulating film O is not between the transparent substrate10 and the pixel electrode PE. That is, the thickness of the organicinsulating film O between the transparent substrate 10 and the pixelelectrode PE is zero.

In addition, a thickness T11 in the third direction Z of the organicinsulating film O between the transparent substrate 10 and the metalline M is greater than a thickness T12 in the third direction Z betweenthe transparent substrate 10 and the pixel electrode PE. In other words,the pixel electrode PE is located below the level in the third directionZ of the metal line M. That is, the pixel electrode PE is closer to thetransparent substrate 10 than the metal line M.

The second substrate SUB2 includes a transparent substrate 20, alight-shielding layer BM, the common electrode CE, the spacer SP and analignment film AL2. The transparent substrate 20 has a surface (lowersurface) 20A and a surface (upper surface) 20B located on the oppositeside from the surface 20A. The surfaces 20A and 20B are surfacessubstantially parallel to the X-Y plane. The surface 20A faces thesurface 10B. The light-shielding layer BM and the common electrode CEare arranged on the surface 20A. The light-shielding layer BM is locateddirectly above the first side surface E1 and the second side surface E2of the first portion OX, directly above the switching element SW, anddirectly above the gate electrode GE. The common electrode CE isarranged over the pixels PX and covers the light-shielding layer BM. Thecommon electrode CE is electrically connected to the capacitanceelectrode C and has the same potential as that of the capacitanceelectrode C. The spacer SP is formed below the common electrode CE andis in contact with the alignment film AL1. The spacer SP is locatedbetween the organic insulating film O and the light-shielding layer BM.The alignment film AL2 covers the common electrode CE.

The liquid crystal layer LC is located between the first substrate SUB1and the second substrate SUB2 and is in contact with the alignment filmsAL1 and AL2. The liquid crystal layer LC has cell gaps CG1 and CG2. Thecell gap CG1 corresponds to a length in the third direction Z from thealignment film AL1 to the alignment film AL2 in the first region A1. Thecell gap CG2 corresponds to a length in the third direction Z from thealignment film AL1 to the alignment film AL2 in the second region A2.The cell gap CG1 is less than the cell gap CG2. The cell gap CG1 is, forexample, about 1.5 μm. The cell gap CG2 is, for example, about 3.0 μm.

By adjusting the balance between a height H in the third direction Z ofthe spacer SP and the thickness T0 of the organic insulating film O, itbecomes possible to obtain desirable effects while maintain the cell gapCG2. For example, if the thickness T0 of the organic insulating film Ois reduced and the height H of the spacer SP is increased as compared tothe example shown in FIG. 4 , the cell gap CG1 will be expanded. As aresult, in the process of manufacturing the liquid crystal layer LC, aliquid crystal material can be spread more easily. In addition, if theheight H of the spacer SP is reduced and the thickness T0 of the organicinsulating film O is increased as compared to the example shown in FIG.4 , the gap in the third direction Z between the switching element SW orscanning line G and the metal line M can be expanded. As a result,undesirable capacitance between the switching element SW or scanningline G and the metal line M can be reduced.

Each of the transparent substrates 10 and 20 is an insulating substratesuch as a glass substrate or a plastic substrate. Each of the insulatingfilms 11 to 13 is formed of, for example, a transparent inorganicinsulating material such as silicon nitride or silicon oxide. Theorganic insulating film O is formed of, for example, a transparentorganic insulating material such as acrylic resin. Each of the scanningline G, the signal line S and the metal line M is, for example, alayered product of a plurality of conductive layers which are stackedone on top of another and is, for example, a layered product of aconductive layer containing molybdenum (Mo), a conductive layercontaining aluminum (Al) and a conductive layer containing molybdenum(Mo) which are stacked in this order. However, each of the scanning lineG, the signal line S and the metal line M is not limited to this exampleand may be a layered product of a conductive layer containing titanium(Ti), a conductive layer containing aluminum (Al) and a conductive layercontaining titanium (Ti) which are stacked in this order. Note that thescanning line G may be a layered product of a conductive layercontaining molybdenum (Mo) and a conductive layer containing aluminum(Al) and that the conductive layer containing aluminum (Al) shouldpreferably be in contact with the surface 10B. Since the lightreflectance of aluminum (Al) is higher than that of molybdenum (Mo), ascompared to a case where the conductive layer containing molybdenum (Mo)of the scanning line G is in contact with the surface 10B, absorption oflight propagating through the transparent substrate 10 in the scanningline G can be suppressed. Each of the capacitance electrode C, the pixelelectrode PE and the common electrode CE is a transparent electrodeformed of a transparent conductive material such as indium tin oxide(ITO) or indium zinc oxide (IZO). The light-shielding layer BM is, forexample, a conductive layer having resistance lower than that of thecommon electrode CE. For example, the light-shielding layer BM is formedof a non-transparent metal material such as molybdenum, aluminum,tungsten, titanium or silver. Since the common electrode CE is incontact with the light-shielding layer BM, the common electrode CE iselectrically connected to the light-shielding layer BM. Consequently,the resistance of the common electrode CE is reduced. Each of thealignment films AL1 and AL2 is a horizontal alignment film having analignment regulation force substantially parallel to the X-Y plane. Forexample, each of the alignment films AL1 and AL2 is subjected toalignment treatment in the first direction X. Note that the alignmenttreatment may be rubbing treatment or may be photo-alignment treatment.

FIG. 5 is a cross-sectional view of the display panel PNL taken alongline C-D including the scanning line G and the connection portion DEAshown in FIG. 3 .

In the first substrate SUB1, the connection portion DEA is located onthe insulating film 11 and is covered with the insulating film 12. Thepixel electrode PE is in contact with the connection portion DEA via thecontact hole CH penetrating the insulating film 12 and the insulatingfilm 13, and the opening CA of the capacitance electrode C. The firstline portion MX of the metal line M is located directly above thescanning line G. The first portion OX of the organic insulating film Ois located between the scanning line G and the first line portion MX.

In the second substrate SUB2, the light-shielding layer BM is locateddirectly above the first side surface E1 of the first portion OX,directly above the scanning line G, directly above the second sidesurface E2 of the first portion OX (between the scanning line G and theconnection portion DEA), and directly above the connection portion DEA.

FIG. 6 is a cross-sectional view showing the display panel PNL takenalong line E-F including the signal line S shown in FIG. 3 .

In the first substrate SUB1, the signal line S is located on theinsulating film 11 and is covered with the insulating film 12. Note thatanother conductive layer (light-shielding layer or reflective layer)formed of the same material as that of the scanning line G may belocated between the insulating film 11 and the transparent substrate 10.The signal line S is located between the pixel electrodes PE which areadjacent to each other in the first direction X. The second portion OYof the organic insulating film O is located directly above the signalline S and is located between the pixel electrodes PE which are adjacentto each other in the first direction X. The third side surface E3 andthe fourth side surface E4 of the second portion OY are covered with thecapacitance electrode C. Each of the third side surface E3 and thefourth side surface E4 is located between the signal line S and thepixel electrode PE in the first direction X. The second line portion MYof the metal line M is located directly above the signal line S. Inaddition, the second line portion MY is in contact with the capacitanceelectrode C and is electrically connected to the capacitance electrodeC. The second portion OY is located between the signal line S and thesecond line portion MY.

In the second substrate SUB2, the light-shielding layer BM is locateddirectly above the third side surface E3 and the fourth side surface E4of the second portion OY and directly above the signal line S.

FIG. 7 is a schematic view showing the display panel PNL of the presentembodiment. The following description will focus on the spacer SP andthe organic insulating film O. The organic insulating film O is formedin both the above-described display portion DA and the non-displayportion NDA. In the non-display portion NDA, the organic insulating filmO has substantially the same thickness T0 as that of the organicinsulating film O in the display portion DA. From the perspective ofvolume reduction of the organic insulating film O, the organicinsulating film O should not be formed over the entire non-displayportion NDA but should be patterned in such a manner as to overlap thespacers SP in the non-display portion NDA. That is, the spacers SPoverlap the organic insulating film O in the display portion DA and thenon-display portion NDA. In a case where the organic insulating film Ois not formed over the entire non-display portion NDA, in order to makethe cell gap uniform, it is necessary to form spacers having a heightgreater than that of the spacers SP in the display portion DA, in thenon-display portion NDA. In the present embodiment, since the organicinsulating film O has the thickness T0 in the display portion DA and thenon-display portion NDA, it is possible to make the cell gap uniform byproviding the spacers SP having substantially the same height H in thedisplay portion DA and the non-display portion NDA. That is, it is notnecessary to form spacers SP having different heights in the displayportion DA and the non-display portion NDA, and it is possible tosimplify the manufacturing process.

The display device DSP of the present embodiment operates in a modewhere light emitted from the light-emitting element LD is entered fromthe end portion E21 of the second substrate SUB2 and is propagatedthrough the display panel PNL, and the luminance tends to be reduced asthe distance from the light-emitting element LD increases. One reasonfor the luminance reduction is considered to be absorption of light inthe organic insulating film O. That is, the organic insulating film Oabsorbs part of the light propagating through the display panel PNL.Therefore, when the light propagates through the display panel PNL whilerepeating total reflection a plurality of times (100 times or more)within the display panel PNL, part of the light is absorbed in theorganic insulating film O each time the light passes through the organicinsulating film O, and consequently the luminance is degraded as thedistance from the light-emitting element LD increases.

According to the present embodiment, the organic insulating film Ooverlaps the switching element SW but is not between the transparentsubstrate 10 and the pixel electrode PE. Alternatively, the thickness ofthe organic insulating film O formed between the transparent substrate10 and the pixel electrode PE is extremely small. Therefore, as comparedto a case where the organic insulating film O is formed between thetransparent substrate 10 and the pixel electrode PE (or over the entireregion of the display portion DA), the total volume of the organicinsulating film O is small. As a result, the probability of the entry ofthe light propagating through the display panel PNL to the organicinsulating film O is reduced, and the light absorption in the organicinsulating film O can be suppressed. Consequently, display qualitydegradation can be suppressed.

In addition, the organic insulating film O overlaps the switchingelement SW, the scanning line G and the signal line S. The organicinsulating film O is located between the switching element SW and themetal line M (or capacitance electrode C), between the scanning line Gand the metal line M (or capacitance electrode C), and between thesignal line S and the metal line M (or capacitance electrode C). As aresult, undesirable capacitance between wiring lines which overlap eachother can be reduced.

Furthermore, when the light from the light-emitting element LD entersthe organic insulating film O, even if undesirable scattering of lightoccurs on the second side surface E2 of the organic insulating film O,scattered light will be blocked by the light-shielding layer BM arrangeddirectly above the second side surface E2. Therefore, display qualitydegradation can be suppressed.

Furthermore, the third side surface E3 and the fourth side surface E4 ofthe organic insulating film O crosses the alignment treatment directionof the alignment films AL1 and AL2 (the first direction X). Even ifalignment failure of the liquid crystal molecules 32 occurs on the thirdside surface E3 and the fourth side surface E4, undesirable light willbe blocked by the light-shielding layer BM arranged directly above thethird side surface E3 and the fourth side surface E4. Therefore, displayquality degradation can be suppressed.

Note that alignment failure should preferably be reduced even if thelight-shielding layer BM is formed. Therefore, in order to suppressalignment failure on the third side surface E3 and the fourth sidesurface E4, it is possible to perform back-and-forth rubbing, increasethe intensity of rubbing, use a rubbing fabric having long fibers, orthe like.

The light-shielding layer BM only needs to be arranged in such a manneras to block reflected light or scattered light on the side surfaces ofthe organic insulating film O. In addition, in a drive mode where thepotential of the common electrode CE is changed, the light-shieldinglayer BM should preferably be formed of a conductive material. As aspecific example of the light-shielding layer BM, a layered product ofmolybdenum, aluminum and molybdenum, a layered product of molybdenum andaluminum, a layered product of a copper compound and another metal, orthe like can be applied. In a case where the light-shielding layer BM isa layered product of molybdenum and aluminum, a molybdenum layer isarranged on a side of the light-shielding layer BM which faces theliquid crystal layer LC, and an aluminum layer is arranged on a side ofthe light-shielding layer BM which faces the transparent substrate 20.Consequently, it is possible to suppress absorption of light propagatingthrough the transparent substrate 20 and efficiently block reflectedlight or scattered light on the side surfaces of the organic insulatingfilm O. On the other hand, in a drive mode where the potential of thecommon electrode CE is maintained as a constant potential, thelight-shielding layer BM does not need to be formed of a conductivematerial but may be formed of a conductive material. In a case where thelight-shielding layer BM is formed of a non-conductive material, thethickness should preferably be as small as possible for the purpose ofpreventing unnecessary scattering of light. Furthermore, in thelight-shielding layer BM formed of a non-conductive material, it ispreferable that a material having high reflectance should be arranged ona side of the light-shielding layer BM which faces the transparentsubstrate 20 and a material having low reflectance should be arranged ona side of the light-shielding layer BM which faces the organicinsulating film O.

In the first configuration example, the transparent substrate 10corresponds to the first transparent substrate, the transparentsubstrate 20 corresponds to the second transparent substrate, and theinsulating film 12 corresponds to an inorganic insulating film.

Next, other configuration examples will be described with reference toFIGS. 8 to 14 . Note that illustrations of the capacitance electrode Cand the pixel electrode PE are omitted in FIGS. 8 to 14 .

Second Configuration Example

FIG. 8 is a cross-sectional view showing the second configurationexample of the display panel PNL. The second configuration example shownin FIG. 8 differs from the first configuration example shown in FIG. 4in that the organic insulating film O includes a third portion OIbetween the transparent substrate 10 and the pixel electrode PE. Morespecifically, the third portion OI is located between the insulatingfilm 12 and the capacitance electrode C and has a thickness T1 in thethird direction Z. The capacitance electrode C is in contact with theorganic insulating film O. The thickness T1 is less than the thicknessT0. As described above, in the present embodiment, from the perspectiveof suppression of the light absorption in the organic insulating film O,the volume of the organic insulating film O should preferably be small,and also in the second configuration example where the organicinsulating film O is interposed between the transparent substrate 10 andthe pixel electrode PE, the thickness T1 should preferably be small. Forexample, the thickness T1 is less than or equal to ½ of the thicknessT0.

Also in the second configuration example, the total volume of theorganic insulating film O can be reduced, and therefore substantiallythe same effects as those of the first configuration example can beobtained.

Third Configuration Example

FIG. 9 is a plan view showing the third configuration example of thepixel PX in the first substrate SUB1. The third configuration exampleshown in FIG. 9 differs from the first configuration example shown inFIG. 2 in that each of the organic insulating film O and the metal lineM is in the form of a strip extending in the second direction Y. Thatis, the organic insulating film O includes the second portion OY whichoverlaps the switching element SW and also overlaps the signal line S.On the other hand, the organic insulating film O does not include thefirst portion OX. In addition, the metal line M includes the second lineportion MY which overlaps the switching element SW via the organicinsulating film O and also overlaps the signal line S. On the otherhand, the metal line M includes the first line portion MX.

Also in the third configuration example, substantially the same effectsas those of the above-described first configuration example can beobtained. In addition, since the first portion OX is omitted, the totalvolume of the organic insulating film O is further reduced, and thelight absorption in the organic insulating film O can be furthersuppressed.

Furthermore, since the first portion OX is omitted, when the light fromthe light-emitting element LD enters the organic insulating film O,undesirable scattering of light on the second side surface E2 shown inFIG. 2 will be suppressed. Furthermore, the width in the first directionX of the light-shielding layer BM overlapping the scanning line G can bereduced, and the aperture area per pixel can be expanded.

Fourth Configuration Example

FIG. 10 is a plan view showing the fourth configuration example of thepixel PX in the first substrate SUB1. The fourth configuration exampleshown in FIG. 10 differs from the first configuration example shown inFIG. 2 in that each of the organic insulating film O and the metal lineM is in the form of a strip extending in the first direction X. That is,the organic insulating film O includes the first portion OX whichoverlaps the switching element SW and also overlaps the scanning line G.On the other hand, the organic insulating film O does not include thesecond portion OY. Furthermore, the metal line M includes the first lineportion MX which overlaps the switching element SW via the organicinsulating film O and also overlaps the scanning line G. On the otherhand, the metal line M does not include the second line portion MY.

Also in the fourth configuration example, substantially the same effectsas those of the above-described first configuration example can beobtained. In addition, since the second portion OY is omitted, the totalvolume of the organic insulating film O is further reduced, and thelight absorption in the organic insulating film O is further suppressed.

Furthermore, since the second portion OY is omitted, alignment failureof the liquid crystal molecules 32 on the third side surface E3 and thefourth side surface E4 shown in FIG. 2 is suppressed. Furthermore, thewidth in the second direction Y of the light-shielding layer BMoverlapping the signal line S can be reduced, and the aperture area perpixel can be expanded.

Next, the fifth configuration example and the sixth configurationexample will be described with reference to FIG. 11 and FIG. 12 ,respectively. In the fifth configuration example and the sixthconfiguration example, the light-emitting elements LD are arranged andspaced apart from one another in the second direction Y, and theextension direction D1 of the polymers 31 is a direction parallel to thesecond direction Y.

Fifth Configuration Example

FIG. 11 is a plan view showing the fifth configuration example of thepixel PX in the first substrate SUB1. The structure of the fifthconfiguration example shown in FIG. 11 is substantially the same as thatof the third configuration example shown in FIG. 9 except for theabove-described light-emitting elements LD and the above-describedextension direction D1 of the polymers 31.

Also in the fifth configuration example, substantially the same effectsas those of the above-described first configuration example can beobtained. In addition, since the first portion OX is omitted, the totalvolume of the organic insulating film O is further reduced, and thelight absorption in the organic insulating film O can be furthersuppressed.

Furthermore, since the first portion OX is omitted, alignment failure ofthe liquid crystal molecules 32 on the first side surface E1 and thesecond side surface E2 shown in FIG. 2 is suppressed. Furthermore, thewidth in the first direction X of the light-shielding layer BMoverlapping the scanning line G can be reduced, and the aperture areaper pixel can be expanded.

Sixth Configuration Example

FIG. 12 is a plan view showing the sixth configuration example of thepixel PX in the first substrate SUB1. The structure of the sixthconfiguration example shown in FIG. 12 is substantially the same as thatof the fourth configuration example shown in FIG. 10 except for theabove-described light-emitting elements LD and the above-describedextension direction D1 of the polymers 31.

Also in the sixth configuration example, substantially the same effectsas those of the above-described first configuration example can beobtained. In addition, since the second portion OY is omitted, the totalvolume of the organic insulating film O is further reduced, and thelight absorption in the organic insulating film O is further suppressed.

Furthermore, since the first portion OX is omitted, when the light fromthe light-emitting element LD enters the organic insulating film O,undesirable scattering of light on the fourth side surface E4 shown inFIG. 2 is suppressed. Furthermore, the width in the second direction Yof the light-shielding layer BM overlapping the signal line S can bereduced, and the aperture area per pixel can be expanded.

Seventh Configuration Example

FIG. 13 is a plan view showing the seventh configuration example of thepixel PX in the first substrate SUB1. The seventh configuration exampleshown in FIG. 13 differs from the first configuration example shown inFIG. 2 in that the organic insulating film O includes overlap portionsOX1 and OX2 and overlap portions OY1 and OY2. The overlap portions OX1and OX2 overlap the scanning line G. The overlap portion OX1 and theoverlap portion OX2 are spaced apart from each other. That is, theorganic insulating film O does not overlap the scanning line G betweenthe overlap portion OX1 and the overlap portion OX2. The overlap portionOY1 and the overlap portion OY2 overlap the signal line S. The overlapportion OY1 and the overlap portion OY2 are spaced apart from eachother. That is, the organic insulating film O does not overlap thesignal line S between the overlap portion OY1 and the overlap portionOY2. The display panel PNL has the cell gap CG2 shown in FIG. 4 betweenthe overlap portion OX1 and the overlap portion OX2 and between theoverlap portion OY1 and the overlap portion OY2. As a result, in theprocess of manufacturing the liquid crystal layer LC, the liquid crystalmaterial will spread more easily.

Also in the seventh configuration example, substantially the sameeffects as those of the above-described first configuration example canbe obtained.

In the seventh configuration example, the overlap portion OX1 and theoverlap portion OY1 correspond to the first overlap portion, and theoverlap portion OX2 and the overlap portion OY2 correspond to the secondoverlap portion.

Eighth Configuration Example

FIG. 14 is a plan view showing the eighth configuration example of thepixel PX in the first substrate SUB1. The eighth configuration exampleshown in FIG. 14 differs from the first configuration example shown inFIG. 2 in that the organic insulating film O only overlaps the switchingelement SW.

Also in the eighth configuration example, substantially the same effectsas those of the above-described first configuration example can beobtained. In addition, since the first portion OX and the second portionOY are omitted, the total volume of the organic insulating film O isfurther reduced, and the light absorption in the organic insulating filmO is further suppressed.

Next, the effects of the present embodiment based on actual measurementwill be described with reference to FIGS. 15 to 18 .

FIG. 15 is an illustration for explaining a measurement method formeasuring the absorptance of a sample. A light source 101 emitsreference light toward a sample SA. A detector 102 measures thetransmittance of light transmitted through the sample SA. A detector 103measures the reflectance of light reflected off the sample SA. Here, thelight source 101, the detector 102 and the detector 103 are installedsuch that an angle of incidence θi of the reference light with respectto the sample SA, an angle of transmission θt of the light transmittedthrough the sample SA, and an angle of reflection θr of the lightreflected off the sample SA will be a predetermined value. For example,the angle of incidence θi, the angle of transmission θt and the angle ofreflectance θr are equal to each other and are, for example, 5°. Whenthe absorptance (%), the transmittance (%) and the reflectance (%) ofthe sample SA are referred to as A, T and R, respectively, theabsorptance A can be defined as follows.A=100−T−R

Here, it is assumed that haze of the sample SA and scattering of lightin the sample SA can be ignored and the surface of the sample SA isflat.

FIG. 16 is an illustration showing results of absorptance measurement ofmaterials used for forming the organic insulating film O. In thedrawing, the horizontal axis indicates a wavelength (nm) and thevertical axis indicates an absorptance (%). The absorptance of amaterial used for forming the organic insulating film O of the presentembodiment (sample A) and the absorptance of a material used for formingthe transparent substrate of the liquid crystal display device (sampleB) were measured by the measurement method described above withreference to FIG. 15 . The sample A is acrylic resin, and the sample Bis glass. The light emitted from the light-emitting element LD of thepresent embodiment consists of dominant wavelengths of 466 nm (bluewavelength), 531 nm (green wavelength) and 622 nm (red wavelength).

With regard to the sample B, light is hardly absorbed at any wavelength.On the other hand, with regard to the sample A, the absorptance on theshort wavelength side tends to be higher than the absorptance on thelong wavelength side. For example, in the sample A, the absorptance ofthe green wavelength is higher than the absorptance of the redwavelength, and the absorptance of the blue wavelength is higher thanthe absorptance of the green wavelength. It was confirmed that theabsorptance exceeded 1% at the blue wavelength in particular. That is,the light having the blue wavelength of the light emitted from thelight-emitting element LD is more likely to be absorbed in the organicinsulating film O than the light having the red wavelength and the lighthaving the green wavelength. According to the present embodiment, thetotal volume of the organic insulating film O is less than that of acase where the organic insulating film O is formed over the entireregion of the display portion DA. Therefore, the absorption of the lighthaving the blue wavelength in the organic insulating film O can besuppressed in particular, and undesirable chromaticity shift whichoccurs as a result of the differences between the absorptances of thecolor wavelengths of the organic insulating film O when the lightpropagates through the display device DSP can be suppressed, and displayquality degradation can be suppressed.

FIG. 17 is an illustration showing how the light emitted from thelight-emitting element LD propagates through the display device DSP. Thedisplay device DSP includes a transparent substrate 30 in addition tothe display panel PNL. The transparent substrate 20 has a side surface20C facing the light-emitting element LD. The side surface 20Ccorresponds to the end portion E21 of the second substrate SUB2 shown inFIG. 1 . The transparent substrate 30 includes a surface (lower surface)30A, a surface (upper surface) 30B located on the opposite side from thesurface 30A, and a side surface 30C. The surfaces 30A and 30B aresurfaces substantially parallel to the X-Y plane. The surface 30A facesthe surface 20B of the transparent substrate 20. The surface 30B is incontact with an air layer, for example. The side surface 30C faces thelight-emitting element LD and overlaps the side surface 20C. Thetransparent substrate 30 is bonded to the transparent substrate 20 by atransparent adhesive layer AD. The adhesive layer AD is in contact withthe surfaces 30A and 20B.

As indicated by arrows in the drawing, the light emitted from thelight-emitting element LD is attenuated as the distance from anincidence portion, that is, from the side surface 20C and the sidesurface 30C increases. Since the light absorptance in glass used forforming the transparent substrate 10, the transparent substrate 20, thetransparent substrate 30 and the like is less than 0.1% as shown in FIG.16 , the main cause of the attenuation of the emitted light isconsidered to be light absorption in various thin films between thetransparent substrate 10 and the transparent substrate 20 and betweenthe transparent substrate 20 and the transparent substrate 30.

FIG. 18 is an illustration showing results of luminance measurement inthe display device DSP of the present embodiment and display devices ofcomparative examples. In a display device of a comparative example (C),the organic insulating film O is arranged over substantially the entireregion of the first substrate SUB1, and the scanning line G is formed ofa layered product of molybdenum (Mo), aluminum (Al) and molybdenum (Mo).In a display device of a comparative example (B), the organic insulatingfilm O is arranged over substantially the entire region of the firstsubstrate SUB1, and the scanning line G is formed of a layered productof molybdenum (Mo) and aluminum (Al). In the display device DSP of thepresent embodiment (A), as described above, the organic insulating filmO is in the form of a grid, and the scanning line G is formed of alayered product of molybdenum (Mo) and aluminum (Al). The luminance ofeach display device was measured at different distances from theincidence portion. The incidence portion corresponds to the side surface20C and the side surface 30C shown in FIG. 17 . In FIG. 18 , thehorizontal axis indicates a distance from the incidence portion and thevertical axis indicates an absolute value of luminance. As shown in FIG.18 , in the display device DSP of the present embodiment (A), ascompared to the display device of the comparative example (B), the totalvolume of the organic insulating film O is small, and therefore it wasconfirmed that luminance reduction was small even at a large distancefrom the incidence portion and that light attenuation could besuppressed by about 8%. In addition, in the display device DSP of thepresent embodiment (A), as compared to the display device of thecomparative example (C), the total volume of the organic insulating filmO is small and the structure of the layered product of the scanning lineG is different, and therefore it was confirmed that luminance reductionwas small even at a large distance from the incidence portion and thatlight attenuation could be suppressed by about 16%.

As described above, according to the present embodiment, a displaydevice which can suppress display quality degradation can be provided.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

Examples of the display devices which can be obtained from theconfigurations described in the present specification will beadditionally described below.

(1) A display device comprising:

a first substrate;

a second substrate;

a liquid crystal layer located between the first substrate and thesecond substrate and including polymers and liquid crystal molecules;and

a light-emitting element, wherein

the first substrate comprises a transparent substrate, a scanning line,a signal line crossing the scanning line, a switching elementelectrically connected to the scanning line and the signal line, anorganic insulating film overlapping the switching element, and a pixelelectrode electrically connected to the switching element, and

a thickness of the organic insulating film located between thetransparent substrate and the pixel electrode is less than a thicknessof the organic insulating film overlapping the switching element.

(2) The display device of item (1), wherein

the first substrate comprises:

an inorganic insulating film located between the transparent substrateand the pixel electrode; and

a capacitance electrode located between the inorganic insulating filmand the pixel electrode,

the organic insulating film is located between the inorganic insulatingfilm and the capacitance electrode, and

the capacitance electrode is in contact with the organic insulatingfilm.

(3) The display device of item (2), wherein

the first substrate comprises a metal line electrically connected to thecapacitance electrode, and

the organic insulating film is located in at least one of a locationbetween the scanning line and the metal line and a location between thesignal line and the metal line.

(4) A display device comprising:

a first substrate;

a second substrate;

a liquid crystal layer located between the first substrate and thesecond substrate and including polymers and liquid crystal molecules;and

a light-emitting element, wherein

the first substrate comprises a transparent substrate, a scanning line,a signal line crossing the scanning line, a switching elementelectrically connected to the scanning line and the signal line, anorganic insulating film overlapping the switching element, and a pixelelectrode electrically connected to the switching element, and

the organic insulating film is not between the transparent substrate andthe pixel electrode.

(5) The display device of item (4), wherein

the first substrate comprises:

an inorganic insulating film located between the transparent substrateand the pixel electrode; and

a capacitance electrode located between the inorganic insulating filmand the pixel electrode, and

the capacitance electrode is in contact with an upper surface of theinorganic insulating film.

(6) The display device of item (5), wherein

the first substrate comprises a metal line electrically connected to thecapacitance electrode, and

the organic insulating film is located in at least one of a locationbetween the scanning line and the metal line and a location between thesignal line and the metal line.

(7) The display device of any one of items (1) to (6), wherein

the second substrate comprises a light-shielding layer overlapping theswitching element,

the organic insulating film comprises a first side surface located closeto the light-emitting element and a second side surface located on anopposite side from the first side surface, and

the light-shielding layer overlaps the second side surface.

(8) The display device of item (7), wherein

the second substrate comprises a common electrode, and

the light-shielding layer is a conductive layer having resistance lowerthan that of the common electrode and is electrically connected to thecommon electrode.

(9) The display device of one of items (7) and (8), further comprising aspacer located between the organic insulating film and thelight-shielding layer.

(10) The display device of any one of items (1) to (9), wherein theorganic insulating film overlaps at least one of the scanning line andthe signal line in a planar view.

(11) The display device of item (10), wherein

the organic insulating film comprises a first overlap portion and asecond overlap portion which overlap the scanning line or the signalline, and

the first overlap portion and the second overlap portion are spacedapart from each other.

What is claimed is:
 1. A display device comprising: a first substrate; asecond substrate; a liquid crystal layer located between the firstsubstrate and the second substrate and including streaky polymers andliquid crystal molecules; and a light-emitting element, wherein thefirst substrate comprises a transparent substrate, a scanning line, asignal line crossing the scanning line, a switching element electricallyconnected to the scanning line and the signal line, an organicinsulating film, and a pixel electrode electrically connected to theswitching element, the organic insulating film is formed of atransparent organic insulating material, the organic insulating filmcomprises a first portion overlapping the scanning line, the signalline, and the switching element, and a second portion located betweenthe transparent substrate and the pixel electrode, the first portion isformed in a frame shape in a planar view, a side surface of the firstportion is formed along an end of the pixel electrode and surrounds thepixel electrode, a thickness of the second portion is less than athickness of the first portion, the liquid crystal layer includes afirst cell gap directly above the first portion and a second cell gapdirectly above the second portion, the first cell gap and the secondcell gap are thicknesses of the liquid crystal layer including streakypolymers and liquid crystal molecules, the first cell gap is less thanthe second cell gap, and an area of the first portion of the organicinsulating film is smaller than an area of a second portion of theorganic insulating film in a planar view wherein the first portion ofthe organic insulating film and the pixel electrode are spaced apartfrom each other in a planar view; wherein the first substrate comprises:an inorganic insulating film located between the transparent substrateand the pixel electrode; and a capacitance electrode located between theinorganic insulating film and the pixel electrode, the organicinsulating film is located between the inorganic insulating film and thecapacitance electrode, and the capacitance electrode is in contact withthe side surface of the first portion and an upper surface of the secondportion; and wherein the side surface of the first portion is coveredwith the capacitance electrode.
 2. The display device of claim 1,wherein the first substrate comprises a metal line electricallyconnected to the capacitance electrode, and the metal line is disposedon an upper surface of the first portion, the organic insulating film islocated in at least one of a location between the scanning line and themetal line and a location between the signal line and the metal line. 3.A display device comprising: a first substrate; a second substrate; aliquid crystal layer located between the first substrate and the secondsubstrate and including streaky polymers and liquid crystal molecules;and a light-emitting element, wherein the first substrate comprises atransparent substrate, a scanning line, a signal line crossing thescanning line, a switching element electrically connected to thescanning line and the signal line, an organic insulating film, and apixel electrode electrically connected to the switching element, theorganic insulating film is formed of a transparent organic insulatingmaterial, the organic insulating film overlaps the scanning line, thesignal line, and the switching element, and does not exist between thetransparent substrate and the pixel electrode, the organic insulatingfilm is formed in a frame shape in a planar view, a side surface of theorganic insulating film is formed along an end of the pixel electrodeand surrounds the pixel electrode, an area of a first region where theorganic insulating film exists is smaller than an area of a secondregion where the organic insulating film does not exist in a planarview, the liquid crystal layer includes a first cell gap in the firstregion where the organic insulating film exists and a second cell gap inthe second region where the organic insulating film does not exist, thefirst cell gap and the second cell gap are thicknesses of the liquidcrystal layer including streaky polymers and liquid crystal molecules,and the first cell gap is less than the second cell gap wherein theorganic insulating film and the pixel electrode are spaced apart fromeach other in a planar view; an inorganic insulating film locatedbetween the transparent substrate and the pixel electrode; and acapacitance electrode located between the inorganic insulating film andthe pixel electrode, and the capacitance electrode is in contact withthe side surface of the organic insulating film and an upper surface ofthe inorganic insulating film; and wherein the side surface of theorganic insulating film is covered with the capacitance electrode. 4.The display device of claim 3, wherein the first substrate comprises ametal line electrically connected to the capacitance electrode, themetal line is disposed on an upper surface of the organic insulatingfilm, and the organic insulating film is located in at least one of alocation between the scanning line and the metal line and a locationbetween the signal line and the metal line.
 5. The display device ofclaim 1, wherein the second substrate comprises a light-shielding layeroverlapping the switching element, the organic insulating film comprisesa first side surface located close to the light-emitting element and asecond side surface located on an opposite side from the first sidesurface, and the light-shielding layer overlaps the second side surface.6. The display device of claim 5, wherein the second substrate comprisesa common electrode, and the light-shielding layer is a conductive layerhaving resistance lower than that of the common electrode and iselectrically connected to the common electrode.
 7. The display device ofclaim 5, further comprising a spacer located between the organicinsulating film and the light-shielding layer.
 8. The display device ofclaim 3, wherein the second substrate comprises a light-shielding layeroverlapping the switching element, the organic insulating film comprisesa first side surface located close to the light-emitting element and asecond side surface located on an opposite side from the first sidesurface, and the light-shielding layer overlaps the second side surface.9. The display device of claim 8, wherein the second substrate comprisesa common electrode, and the light-shielding layer is a conductive layerhaving resistance lower than that of the common electrode and iselectrically connected to the common electrode.
 10. The display deviceof claim 8, further comprising a spacer located between the organicinsulating film and the light-shielding layer.